Verry nice video. Addition: W/(m*K) is really (W * m)/(m² * K), the one m/m just gets cancled out. It is Watts needed to sustain a delta T of 1°C through a block of the material with a cross section of 1 m² and a depth of 1 m. Then there is W / m² * K which gives the Watts per 1° C difference, when there is heat transport from one material to another, like copper to air. Since there is no thickness of a contact surface, it just scales with the contact area. And at last is W/K which is used for a fixed structure like a heatsing, meaning how many watts it can dissipate per 1° C temperature difference. It is also often used in electrical components like mosfets and led for the junction to case and junction to ambient heat conductivity. This unit includes the entire material composition and geometry of the component, whoch both previous units don't do.

Those are some neat materials. I guess when you print it vertically, you get air between the layers that acts as an insulator and minimal contact with the previous layer giving reduced thermal conductivity. Printing on it's side would mean each layer was in contact with the heat source and radiating outwards, with the inter layer gaps more like the gaps between the fins on a standard metal heatsink.

You are just so awesome Rinoa!

Nice experiment! Try annealing the models in the oven. If done right it ought to fuse the layers and help out those easier to print models..

Definitely an interesting test, well executed by the way. Glad this video came thru my feed!

Gosh, I love your Channel!

Cool test! Great video thanks.

Nice experiments! :)

The idea of measuring the temperature of the air using a sheat of paper was very cool. I might use it some day :)

Way cool experiment. Undeniably good scientific method and results.

What also would work, is ceramic, there is a Ceramic filled Resin for SLA printer, after printing you would burn it in a Kiln, and after that you got a Ceramic part. Ceramic Heatsinks are an actual thing.

the paper was such a good idea!

Tungsten carbid and silicon carbid amongst most out to cpu cooling basis due to silicon nature can you inspect it

Maybe if you could copper coat the form it may help with the heat transfer, looks an excellent experiment all the same 👍

I'd be interested in seeing a comparison of each materials' performance using a >=0.8mm nozzle and layer height >0.5(nozzle dia.) (I read TCPoly's Print Guide 🤓)

A thermally conductive filament could be good for printing a heat exchanger.

I think carbon fiber filled filament should be good for transfer heat, maybe glass filled as well. Another thing you can do is printing sponge like structure and fill the gaps with thermal paste.

ive never been so confused

Me: "How good can a thermal camera be?" Also me: "Holy cow"

Hi Rinoa! Hope you are doing well. What power supply are you using or the LED?

1:05 Thats a neat shaped instrument, how do you play it? Do you know any songs? jk

Cool!, I mean hot, lol

But i am crazy and am watching you. sooo something went wrong. ^^

I don't understand why it's called heatsink. there is neither ink involved nor heating of ink

That blue heatsink most likely came from a Dell Optiplex circa 1997-1999 and used to cool a Pentium MMX or perhaps a socket 370 Celeron.

you confuse me totally. maybe if it was not logical to you that the vertically printed heatsink would perform better is ok. But what happened to printing your copper filament vertical and perform the test again. Ane maybe if you heat your bed a bit more along with the nozzel and slow down the print just a tad then run that test again with the termal cam...Im sure it would out perform the other vertical print

First