Dave said "it's a pain in the ass" hence my response, everyone.

And he talks slowly, so run it at 1.5x speed, and skip past the bits that aren't relevant.

I think your potential PCB manufacturers opinions about via-in-pad are more important than Dave's. No disrespect to Dave intended. It's a viable technology, *if it can be manufactured reliably.*

+irgski I use vias in pads all the time and they work well. You get the added benefit of better thermal conductivity. I use exposed copper on the other side, so I have a "free" heat sink as well (assuming you can form a continuous ground or power plane on the other side). You just need to watch out for the solder getting wicked to the opposite side (capillary effect through vias).

Different types of capacitors have different physics, like an electrolytic capacitor has a lot of capacitance easily, but a lot of internal resistance compared to a ceramic capacitor. Internal resistance limits the amps a bit, which matters a lot when you get into really small stuff. Also, in addition to ESR differences, a ceramic capacitor is piezoelectric a bit, while an electrolytic capacitor has things like dielectric absorption. You just gotta remember every component isn't made of the same stuff, therefore not every component has the same exact physics, just works as a component with its own advantages and disadvantages. For 1.1uF and .1uF, you'd have the low capacitance capacitor with a very low ESR to filter out high-frequency-low-amplitude noise or fluctuations in voltage, where the larger capacitor does the bulk of stuff like handling when the device suddenly surges its power consumption and needs a little extra power. Ceramic capacitors, Electrolytic capacitors, aluminum capcitors, polymer capacitors, paper capacitors, tantalum capacitors, mica capacitors, there's tons of different kinds. I think dave has a video on them actually.