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Ever since the launch of the iPhone X, Apple has used a double-stacked board to save more space. The disadvantage of such smart design is the increasing difficulties in board-level repairs. And now we share an easy and efficient solution for you to separate, re-ball, and restore the motherboard for iPhone X. This fundamental technique is very crucial for double-stacked board-level repairs. We hope you enjoy watching it.
Tools and materials used in this video:
Heating platform: bit.ly/3734ldR
Soldering iron: bit.ly/2XpEN7z
Hot air gun: bit.ly/3du6lyb
Microscope: bit.ly/3gLIs7n
Motherboard fixture: bit.ly/3dw0cl3
Desoldering braid/Solder wick: bit.ly/3eGL2d4
Tweezers: bit.ly/36SxHM7
Rosin
Cleanroom wipes
Soft brush: bit.ly/3gQJleK
Solder flux
PCB cleaner
Questions are most welcome!
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