This colloquium focuses on heat transfer applications of additive manufacturing, which enables new device geometries, systems architectures, and materials. These innovations offer the potential to impact heat transfer performance, system compactness, and energy efficiency.
Panelists: Bill King, University of Illinois Urbana-Champaign
Jae Sung Son, Ulsan National Institute of Science and Technology,
South Korea
Ole Sigmund, Technical University of Denmark, Denmark
Moderator: Saniya LeBlanc, The George Washington University
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