In mobile device repair, changing integrated circuits like the PMIC or IF Pmic is a crucial skill that can be completed in less than 10 minutes with experience. Repairing thousands of devices has provided valuable insights and techniques for resolving these issues, often leaving more complex problems like CPU and memory failures to experts.
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To reball an integrated circuit, first remove excess solder by soldering at 350°C. Next, use an economical stencil and apply 180°C solder paste with lid. Numerous videos on KZfaq can help guide you through this process, offering detailed explanations and demonstrations. After the reballing process, apply flux and heat the component for five to six seconds at 350°C to ensure even balls.
When there is a gap between two balls, apply a UV mask and cure it to prevent problems during soldering. This helps eliminate the risk of balls bonding underneath the circuit. An economical ultraviolet flashlight from AliExpress can be used to cure the UV mask.
Soldering the circuit requires a thin layer of flux to improve micro soldering. Use a temperature of 380°C and an air flow of 30 percent for optimal results. For larger circuits, increase the air flow by 10 percent. Finally, clean the area thoroughly with contact cleaner or isopropyl alcohol to ensure a professional result.
In summary, changing integrated circuits in mobile device repair is an essential skill that can be performed efficiently with experience. Reballing and soldering circuits require careful attention to temperature, soldering techniques, and cleanliness. Utilizing tips like applying UV masks to gaps and curing them can make the process more successful. With the right knowledge and practice, technicians can effectively repair mobile devices, providing a valuable service to their clients.
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