Nanoindentation is an analysis to determine the mechanical properties (Hardness and Reduced Modulus) of the surface of a solid-state material. The application includes thin film analysis, biomaterials, solder, composite material, and coatings. Additional analysis includes Scanning Probe Microscopy and Dynamic Mechanical Analysis.
Please contact:
Ir. Dr. Soon Chin Fhong
Microelectronics and Nanotechnology-Shamsuddin Research Centre
Universiti Tun Hussein Onn Malaysia
soon@uthm.edu.my