hahahaha

I feel like I've heard his voice at an airport as well.

I use the Pace - MBT250-SDTP, A little more advanced.

yep when china have ripped off the design, same goes for the cheap flush nippers, ripped off an old plato design, some cheap chinese soldering irons are also copied from weller 1960's, which they dont make anymore, there are dozens of other examples!

I was very impressed with how this remained incredibly relevant despite the rapid acceleration in sophistication technology constantly exhibits

Btw. I'm still using the exact same solder sucker. And I don't mean the same model, I'm talking about the same thing. I went at the tip once or twice with a knife to clean it up, but it still works. Can't beat that for 2€. Now what do I do with the 3 additional ones I bought? XD I got them immediately after I used the first one for a short time, because it worked so well. I wanted to have some spares just in case I couldn't get them later anymore. That was before I knew they've been around for at least 30 years at the time, and before I knew that a single one would work for many years. And also they are still available to buy.

Soldapullt!!

😐

Movement (1) by Barry Morgan and Herbie Flowers

Forgive the necropost here, but in my experience, the boards themselves haven't really improved (if anything, they're made worse than they used to be), but components themselves have become less sensitive to heat. For instance, if I were replacing an IC in an 8 bit computer, I would be really cautious about dwell time when I install the new chip. I might even socket it just to eliminate the possibility of ruining the replacement part. But on a new part on a new board? I would worry more about ruining a pad than an IC. I've even seen some people remove ICs by globbing a ton of solder on all legs, creating a massive bridge, and then wicking the solder away or heating the chip with a hot air rework gun. And then the chip is actually fine at the end of it. I can't imagine that being a good idea on 1980's ICs.

Yep, you're absolutely right. Nowadays a LOT of components are actually incredibly resistant to heat, even the most common 0402/1005 packages. Semiconductors are still prone to heat damage but it greatly depends on the makeup of the package. ICs and (most) BGAs actually contain a lot of heatsinking as the actual chip die resides under a thick layer of epoxy resin, making hot air removal a non-problem unless you're really dumb or still practicing with how best to use it. However, something like a CPU is where you want to keep heat to a minimum. Sure, it has all the benefits of a thick epoxy resin, but it also contains billions of semiconductors and all it takes is for one of them to fail or become dislodged to keep it from functioning. Board makeup has not changed much over the last 20 years. You still have the common ceramic, mylar, and epoxy glass makeups. What has changed however is the use of coatings and resins. Most boards which contain BGA flip chips utilize underfill, which is basically a resin that fills an excavated basin beneath the chip and flows around the ball array. The purpose of this is to keep the balls from oxidizing and it also maintains a secure mechanical connection with the chip. The downside is it's a pain to deal with. All underfills are different and Apple likes to use a type that actually hardens into the equivalent of concrete when it passes a very small temperature window where it's soft enough to pull the chip without damaging a pad. Samsung on the other hand has a very easy kind to deal with, where this hardening state doesn't happen. However all underfills universally contract as they are being heated. This can cause components in the underfill to literally pop out of their solder joints. Nowadays there's a lot less emphasis on the necessities of absolute control over heat, at least in the realm of consumer electronics repair. However the rules still apply. Back in the 80's you'd run the risk of destroying a transistor and damaging its pad if you used too much heat. Nowadays that same amount of heat will definitely get that transistor off and it will still be fine, but the pad most definitely will not be. Especially in regards to wicking, which is something to always be mindful of when it comes to heat. In my own experience I've never damaged pads from simply removing a component. However, it's guaranteed I'll pull a pad if I use too much heat when wicking.

@@ZiggyTheHamster But will the IC still work at long-term? (I'm new to soldering) They've said in other videos that stuff may work for a day or week or a month, but may fail after that, if it was heated up too much. Unless these things are actually resistant to near this amount of heat and then it's fine if it's not that long.

@@Edw590 the way that the smaller processes work nowadays, it isn't really possible to sink enough heat to degrade it but not enough to kill it. If you heat it too long/hard, it just dies. The crossover point is very small, compared to vintage ICs where you can easily damage a gate without immediately killing the IC. There are some exceptions to this. Some Intel Atom CPUs have gates that degrade due to heat, but that's in-die heat and prolonged. vs. soldering which would be over rather quickly

No more than 2-3secs !

ROHS only applies when you throw away components, not when you simply remove them.

and you can still use lead solder to repair items, rohs doesnt affect that