May 14, 2024 Colloquia
Department of Computer Science & Engineering
The Evaluation of Dihedral Angle Twin Boundaries in Copper
The evaluation of dihedral angles of twin boundaries enables researchers to gauge the ratio of surface energies in deferent crystallographic orientations in FCC metals. Employing 3D printing, twin boundaries in copper were simulated, facilitating deeper understanding of granular microstructure and nature of annealing twins. Characterization was done using a range of microscopy techniques- optical, electron and atomic force microscopies. Additionally, this study delves into a comparative analysis of AFM-based findings against alternative methodologies.
RESEARCHERS: Phinna Y., Washington High School '26; Saahithi S., Monta Vista High School '27; Saketh P., Dougherty Valley High School '26; Brady S., Foothill High School '25; Michael R., Sequoia High School '25; Rui Z., Irvington High School '25; Darvas G., Washington High School '25; Ayush P., Fremont High School '26; Rohan S. P., BASIS Independent Fremont Upper '25; Raghav R., Archbishop Mitty High School '26; Avish Z., American High School '26; Arjun K., Quarry Lane '25
ADVISOR: Starostina, Materials Science
KEYWORDS: Grains l Twin Boundaries l Twinning Planes l Interfacial Free Energy l Microscopy l Copper l Fcc Metals