Electromigration and Reliability in VLSI

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Electromigration and Reliability in VLSI | Why do chips die?

Рет қаралды 8,435

3 жыл бұрын

This video gives an overview on Reliability of chips and electromigration. What is electromigration ? Why does it happen? and what are the ways in which this can be reduced ? has been discussed.
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Пікірлер: 18

@HarNilBandhiya 6 ай бұрын

Thanks 🙏🙏🙏 for great explanation

@zvi303 2 жыл бұрын

I just played this video for my father, who spent his life in this field and wrote some of the important papers. He really enjoyed it. Good job, sir!

@jairamgouda 2 жыл бұрын

This gives huge amount of satisfaction for the making of this video. Thanks a lot for your time and support.. 😊

@rajasekharnallamekala4950 3 жыл бұрын

thank you so much for your brief explanation

@b.s2086 Жыл бұрын

excellent presented, thank you

@clappytpt3847 2 жыл бұрын

Why do we need to check for three different currents (DC, RMS & Peak) in Signal EM Analysis and only DC current in Power EM? Any specific reason for this?

@bkahraman99 Жыл бұрын

thanks man! super helpful video

@meenakshisharma2365 2 жыл бұрын

Thank you so much sir for nice explanation..would you please provide ppt for this?

@nirmalnikitha8596 2 жыл бұрын

How can we reduce the frequency sir

@jairamgouda 2 жыл бұрын

Reducing frequency is not always an option. But if it can be done, it has to be done at RTL design not at the physical design. It can be done for that specific paths for example.

@nirmalnikitha8596 2 жыл бұрын

@@jairamgouda sir can you explain how can the charges accumulate during plasma etching in the antenna effect

@jairamgouda 2 жыл бұрын

@@nirmalnikitha8596 I hope you've watched my video on antenna effect. If you haven't please watch it. kzfaq.info/get/bejne/sL6Ths6i2p_QY3U.html. Since you've asked specifically, I'll give more idea about it. Plasma etching, as I've explained in the video is dry etching. -> This plasma is nothing but charged particles containing free electrons, free radicals, ions etc. Their job is to impart their kinetic energy to directly convert the atoms in solid state to gaseous state. -> Let's say it's happening for a gate metal connection in metal layer 0 or metal 1. Then if the plasma contains free electrons, don't they get accumulated in the metal? -> Well, if it was just accumulation, it was fine. They'll have high energy. They will move very fast and hit the gate oxide. Try to punch through by tunneling. ->If they have enough energy they can actually tunnel through or completely destroy the gate oxide since it's very thin (few angstroms). This is similar to fowler-nordheim tunneling. Now your transistor is gone 🙃 Hope you got some idea. Please do like, share and subscribe if you haven't done yet.

@anandkumar-bd2ru Жыл бұрын

very good

@reeazhasan4906 Жыл бұрын

What does n represent in the MTTF equation ?

@SalahUddin-ov7rz Жыл бұрын

hi sir big fan

@tirupatip2194 2 жыл бұрын

Is IR & Antenna effect also considering under Reliability issues ?

@jairamgouda 2 жыл бұрын

IR drop issue and Antenna effect are directly related to functionality of the chip. Think about it. If there's significant IR drop, the standard cells won't get enough power, it may slow down and it may not work as intended. It's a functionality failure and timing failure which can be considered as performance failure. It doesn't need many moths or years to happen. Perhaps a particular PVT corner may result into this. Antenna effect on the other hand is hazardous if not taken care. The transistors will be destroyed during manufacturing only. So, there is no way that the transistors will work. So, both of these are not part of reliability. Reliability is something like "Do you want to buy iron bar or steel bar?". Which is more reliable ?

@tirupatip2194 2 жыл бұрын

@@jairamgouda Thank you so much for your brief explanation. 👍