An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit nptel.iitm.ac.in
Пікірлер: 13
@tamilselvans35553 жыл бұрын
This is the best video and technical knowledge session, Excellent sir
4 жыл бұрын
This is the best video i find about thermal profiles
@firepower99662 жыл бұрын
Great Teaching, detailed and clear descriptions.
@sergeysergey53073 жыл бұрын
very useful information, all theory in one video, excellent work
@jonasjonsi34010 жыл бұрын
Hey, I think there's a mistake. At the right side you take some notes concerning the eutectic point. It has to be 63:37 - Pb:Sn according to your phase diagram. However, you speak of 63:37 - Sn:Pb in your shear strength diagram?!?
@fufu84035 жыл бұрын
Didn't see any mistake. The X axis is wt.% of Sn and the eutectic point is 63Sn-37Pb.
@pradeepkumaryadav33753 жыл бұрын
Tin lead alloy why not used in gold and silver plating
@samynashabeh4 жыл бұрын
Mistake at 33:02 - He said the percentage tin is 3% and that's wrong. The percentage tin is 96.5%, percentage of silver is 3% and percentage of copper is 0.5%.
@prahladsharma59374 жыл бұрын
Can you tell me what will be Happen when reflow tem increese above to 250Dc
@adambimantoro78054 жыл бұрын
please help to make profile for my mesin sir ....my mesin Honton R392...