Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering

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Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering

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An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit nptel.iitm.ac.in

Пікірлер: 13

@tamilselvans3555 3 жыл бұрын

This is the best video and technical knowledge session, Excellent sir

4 жыл бұрын

This is the best video i find about thermal profiles

@firepower9966 2 жыл бұрын

Great Teaching, detailed and clear descriptions.

@sergeysergey5307 3 жыл бұрын

very useful information, all theory in one video, excellent work

@jonasjonsi340 10 жыл бұрын

Hey, I think there's a mistake. At the right side you take some notes concerning the eutectic point. It has to be 63:37 - Pb:Sn according to your phase diagram. However, you speak of 63:37 - Sn:Pb in your shear strength diagram?!?

@fufu8403 5 жыл бұрын

Didn't see any mistake. The X axis is wt.% of Sn and the eutectic point is 63Sn-37Pb.

@pradeepkumaryadav3375 3 жыл бұрын

Tin lead alloy why not used in gold and silver plating

@samynashabeh 4 жыл бұрын

Mistake at 33:02 - He said the percentage tin is 3% and that's wrong. The percentage tin is 96.5%, percentage of silver is 3% and percentage of copper is 0.5%.

@prahladsharma5937 4 жыл бұрын

Can you tell me what will be Happen when reflow tem increese above to 250Dc