Semiconductor Packaging - ASSEMBLY PROCESS FLOW

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Күн бұрын

This is a learning video about semiconductor packaging process flow. This is a good starting point for beginners. - Watch Learn 'N Play
UPDATE 8/15/2022: FIXED ENGLISH SUBTITLE. PLEASE USE SUBTITLE IF YOU CANNOT UNDERSTAND MY ACCENT (PARDON MY ACCENT AND MY GRAMMAR TOO :) )

Пікірлер: 52

@KevinMccable 7 ай бұрын

Thank you very much for making impressive video. This is absolutely perfect video due to you also add up real processing video including illustrator. I work for semiconductor industry for 16yrs still surprise the way you make video presentation. Please keep going.

@wenelleho8907 Жыл бұрын

Really informative , precise, detailed video… really helpful for those who have no clue about semiconductor packaging. It is very good that you explained all those steps in lay-man terms and not the fancy jargon … Thank you so much .. I will be looking forward to Part 2!

@watchlearnnplay Жыл бұрын

Thanks for the comment. More videos to come

@shauncesar108 11 ай бұрын

this is an EXCELLENT video! thank you very much!

@ragytag Жыл бұрын

This is amazing! Keep the great videos coming.

@sebastianocataudo8785 Жыл бұрын

Very very good video! Thank you!

@hiepchu6028 12 күн бұрын

So helpful I hope you can continue making videos

@obensustam3574 Жыл бұрын

Great video man!!!! Thank you so much ❤

@superboard2930 Жыл бұрын

Very impressdive. easy to understand for beginners. I learnt a lot from this video. Thank you.

@dhanturp8320 Жыл бұрын

This video is very informative. Thanks for doing this.

@danielmercado8871 Жыл бұрын

Thank you for the very informative video sir! We hope you continue to share more of your knowledge po :D Test Engineer here

@actandrepeat Жыл бұрын

I study computer science and this was very useful for my computer network architecture class

@vlsigk8561 Жыл бұрын

Very informative video good work

@cmanish93 Жыл бұрын

Great content !

@wayunoi Жыл бұрын

your video sharing is very informative. Thanks for provided

@dennisbocalbos5973 Жыл бұрын

very informative yan Sir LGALE......one of most respective Equipment Engineer during our Semicon time...i really miss it!!!......keep it up!!!😀

@watchlearnnplay Жыл бұрын

DBOCA thanks for the positive comment. After 30 years I thought it is time to share the knowledge and experience that I think will be helpful for beginners in the industry and even for those just graduating from college / university. I miss it too! Watch out for more upcoming videos

@HemangJoshi Жыл бұрын

Very good video sir...👍👍👍

@alotan2acs Жыл бұрын

Excellent! Very detailed. Fantastic info; can't find this elsewhere. Bravo pal.

@yazanalzaidi2279 4 ай бұрын

Very informative, thank you

@Nurtastube 7 ай бұрын

Great video! 👍

@b.c8421 10 ай бұрын

this is really great video and great explanation. maybe it is worth to compare or to explain the new "panel-level-packaging". seems to be new packaging technology. would be great to learn more about it.

@d-nguyen5620 10 ай бұрын

thank you for sharing

@user-vo3fg8sy2i 8 ай бұрын

I had work with the position Process Engineer of Wire Bonding stage for one year. I miss KNS Maxum +, Iconn machine.

@tpnch3933 3 ай бұрын

Thanks!

@jame2237 3 ай бұрын

this is great.

@trailrunning11vlog Жыл бұрын

Galing pre

@cadcaetutorial2039 Жыл бұрын

Weldon sir

@MrHardgabi Жыл бұрын

amazing

@KarthiK-tp8pq 6 ай бұрын

Thank you for making detailed video. Is DIE attached with wafer tape?

@paulweston8184 7 ай бұрын

I'm glad I watched this *after* I delidded my CPU to apply new TIC to the die. I would've felt like I was diffusing a bomb.

@naveenkadkol9731 10 ай бұрын

Very informative 👍. Thank you. One request, can you please cover the process of Wafer manufacturing

@royaumedelame3947 Жыл бұрын

slay, ur accent is fine :)

@chiahsiangliao2901 Жыл бұрын

learn a lot about process flow .

@gizachewdiga7648 3 ай бұрын

The best illustration Semiconductors wafer, chips and devices such as transisors. I hope this discussion be extended to Field effects transistors such as MOSFETS, POSFETS, and Biosensors.

@freethinker585 Жыл бұрын

awesome ilustration, thanks for sharing. the next video plz explain about how lithograpy work.

@watchlearnnplay Жыл бұрын

Thanks for the feedback.

@cryptoeagle3679 Жыл бұрын

Is this somewhat the process at the Intel back end semiconductor factory?

@jonrenielnorca9221 4 ай бұрын

I watched this on my phone while my teacher is presenting this

@watchlearnnplay 3 ай бұрын

Happy to know that my video is useful for teaching / learning.

@camiemengineer Жыл бұрын

GOOD VIDEO EXCELLENT EVEN ... EXCEPT Why didn't you include the full KZfaq video links in the description?

@watchlearnnplay Жыл бұрын

Thanks for the feedback. I intentionally did not include the links in the description as I want the focus to be on the learning video. I mentioned the reference video mainly o give credit and respect to the original creator.

@user-dr8ul1zt4w 11 ай бұрын

Hi, your slide and explanation are really good. Do you mind to share your slide?

@Tyco072 Жыл бұрын

Hi! Fantastic video! It is the most detailed video existing. But I don't understand how dies of extremely small size, few tenths of millimeters, like the dies of small transistors like the BC337, can be sawed and separated from the plastic film, without the get pushed away. And how they can be picked up to be transported on the final package. Please could you explain me it, or make a next video for it?

@watchlearnnplay Жыл бұрын

Thanks for the comment. The wafer saw video I posted will give better understanding of the sawing process. I will also create a more detailed video related to die attach process.

@Tyco072 Жыл бұрын

@@watchlearnnplay Thank you for your reply! Yes I watched also the video about the wafer sawing. It's very good too! but the dies in the video are big. I can figure how it may work with large dies, but with very small dies, few tenths of millimetres large, it is all different to handle, I guess. Then I am looking forward to watch your video about the die attach! :) Also concerning large dies, how are they exactly picked up from the wafer, without being damaged? As far I know, nothing should touch the upper surface of a diffused and finished chip, otherwise the material, the structures and tracks would be damaged and the chip would be unusable. Or not? With sub-millimetre dies it is even more difficult. Thank you again for your great videos. Do you work in a semiconductor factory?