The Z direction on a PCB multi-layer is remarkably restrictive. We simply do not draw copper from one layer to the next. We must make use of a copper structure called the via. Over time, to accommodate small components and densely populated boards, more via options have been made available.
In this video, we will discuss:
• Sanity check - Make sure that the desired via type works with the stack up
• Annular rings - the equation to ensure the right fit / hit
• Explore non-traditional vias types - microvias, back drilled vias, vias-in-pad
• Documentation - what automatically gets generated and what needs to be provided as a fabrication note
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