Should take more care applying the solder paste. Here, it was covering components you didn't mean to touch, so you don't really know if you disrupted their solder joints or shorted anything. Think solder paste is also meant to be applied to the pads and heated with the component in place. What you did here is basically tin the pads, which is fine, but can also be done with less mess using normal solder and flux (basically what you did after). If you're using tinned pads, you should use an iron with an appropriately shaped tip to glide over the pins, heating each up and melting the solder underneath. Shorts between contacts can be cleaned up with some more flux and using the iron to remove excess solder. Accurate positioning and good magnification while working helps. Your initial chip position here seemed offset, putting pins between contacts instead of on them. Obviously, don't put the chip on backwards.

u do realise those r 'cold soldered' and the circuit and board may have been damaged? ... ..and the circuit is in the wrong orientation!?